In Stock Min. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
SPD08-100-RB-TR Tech Specifications
3M SPD08-100-RB-TR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Factory Lead Time | 7 Weeks | |
Contact Plating | Gold | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Housing Material | Polymer | |
Material - Insulation | Liquid Crystal Polymer (LCP), Glass Filled | |
Contact Materials | Copper Alloy | |
Operating Temperature | -55°C~125°C | |
Packaging | Tape & Reel (TR) | |
Series | SPD08 | |
Published | 2011 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Termination | Solder | |
Connector Type | Cantilever | |
Number of Positions | 100Positions | |
Max Operating Temperature | 125°C | |
Min Operating Temperature | -55°C | |
Color | Black | |
Number of Rows | 2Rows | |
Gender | Female | |
Contact Type | Cantilever | |
Pitch | 0.031 0.80mm | |
Orientation | Straight | |
Contact Finish | Gold | |
Housing Color | Black | |
Contact Resistance | 50mOhm | |
Card Type | Non Specified - Dual Edge | |
Read Out | Dual | |
Max Voltage Rating (AC) | 50V | |
Max Current Rating | 300mA | |
Features | Board Guide | |
Contact Finish Thickness | 30.0μin 0.76μm | |
Card Thickness | 0.062 1.57mm | |
RoHS Status | RoHS Compliant |
SPD08-100-RB-TR Documents
Download datasheets and manufacturer documentation for SPD08-100-RB-TR
- DatasheetsSPD08 Series Overview SPD08 Series Drawing SPD08 Brief
- Mfg CAD ModelsSPD08-100-XX-XX.igs SPD08-100-XX-XX.x_t SPD08-100-XX-XX.stp
- ConflictMineralStatement3M-company-24.pdf
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ