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232-1270-02-0602 Tech Specifications

3M  232-1270-02-0602 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Package / Case 0602
Number of Pins 32Pins
Housing Material Polysulfone (PSU), Glass Filled
Number of Positions or Pins (Grid) 32 (2 x 16)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Gold
Operating Temperature -55°C~125°C
Packaging Bulk
Series Textool™
Published 2007
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type PGA, ZIF (ZIP)
Gender Female
Current Rating (Amps) 1A
Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Contact Finish - Post Gold
Contact Resistance 25mOhm
Termination Post Length 0.154 3.90mm
Pitch - Post 0.100 2.54mm
Features Closed Frame
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
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232-1270-02-0602 Documents

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