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228-1290-09-0602J Tech Specifications

3M  228-1290-09-0602J technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Number of Pins 28Pins
Housing Material Polysulfone (PSU), Glass Filled
Body Material Glass, Polysulfone
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Gold
Contact Materials Copper
Operating Temperature -55°C~125°C
Series Textool™
Published 2001
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 28Positions
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Gender Female
Current Rating (Amps) 1A
Pitch 1.78mm
Orientation Straight
Depth 6.9mm
Current Rating 1A
Pitch - Mating 0.070 1.78mm
Number of Contacts 28Contacts
Contact Finish - Post Gold
Insulation Resistance 1GOhm
Row Spacing 10.16 mm
Termination Post Length 0.130 3.30mm
Pitch - Post 0.070 1.78mm
Convert From (Adapter End) DIP, 0.4 (10.16mm) Row Spacing
Convert To (Adapter End) DIP, 0.4 (10.16mm) Row Spacing
Length 40.5mm
Width 27.9mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
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