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100-032-051 Tech Specifications
3M 100-032-051 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Gold | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Number of Pins | 32Pins | |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | |
| Number of Positions or Pins (Grid) | 32 (2 x 16) | |
| Contact Material - Mating | Beryllium Copper | |
| Contact Material - Post | Brass | |
| Contact Finish Mating | Gold | |
| Operating Temperature | -65°C~125°C | |
| Packaging | Bulk | |
| Series | 100 | |
| Published | 2008 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Type | DIP, 0.6 (15.24mm) Row Spacing | |
| Current Rating (Amps) | 1A | |
| Pitch | 2.54mm | |
| Pitch - Mating | 0.100 2.54mm | |
| Contact Finish - Post | Gold | |
| Termination Post Length | 0.126 3.20mm | |
| Pitch - Post | 0.100 2.54mm | |
| Features | Closed Frame, Seal Tape | |
| Contact Finish Thickness - Mating | 8.00μin 0.203μm | |
| Contact Finish Thickness - Post | Flash | |
| Material Flammability Rating | UL94 V-0 | |
| RoHS Status | RoHS Compliant |
100-032-051 Documents
Download datasheets and manufacturer documentation for 100-032-051
- Datasheets1x0-0xx-05y
- PCN Obsolescence/ EOLSMSK Series 26/Jun/2008
- ConflictMineralStatement3M-company-24.pdf
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