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C-DQ8FNM003-H0-M Tech Specifications

Nvidia  C-DQ8FNM003-H0-M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Housing Material Polyphenylene Sulfide (PPS)
Number of Positions or Pins (Grid) --
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Gold
Operating Temperature -65°C ~ 125°C
Series PRS
Packaging Bulk
Part Status Active
Termination Solder
Type PGA, ZIF (ZIP)
Current Rating 1A
Pitch - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
Contact Resistance --
Termination Post Length 0.125 (3.18mm)
Pitch - Post 0.100 (2.54mm)
Features Closed Frame
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish Thickness - Post 200.0µin (5.08µm)
Material Flammability Rating UL94 V-0
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