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HSP50306SC-25 Tech Specifications

Intersil  HSP50306SC-25 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width)
Surface Mount YES
Supplier Device Package 16-SOIC
Number of Terminals 16Terminals
Mfr Intersil
Package Bulk
Product Status Active
RoHS Non-Compliant
Package Description SOP,
Package Style SMALL OUTLINE
Package Body Material PLASTIC/EPOXY
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 70 °C
Rohs Code No
Manufacturer Part Number HSP50306SC-25
Package Code SOP
Package Shape RECTANGULAR
Manufacturer Rochester Electronics LLC
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Risk Rank 5.21
Part Package Code SOIC
Series -
JESD-609 Code e0
Pbfree Code No
Terminal Finish TIN LEAD
HTS Code 8542.39.00.01
Voltage - Supply 4.75V ~ 5.25V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 16
JESD-30 Code R-PDSO-G16
Function Demodulator, Detector
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Current - Supply 114 mA
Seated Height-Max 2.65 mm
Gain -
Telecom IC Type TELECOM CIRCUIT
Noise Figure -
P1dB -
RF Frequency -
LO Frequency -
Width 7.5 mm
Length 10.3 mm
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