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KMDP6001DA-B425 Tech Specifications

Samsung  KMDP6001DA-B425 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Contact plating gold-plated
Number of pins 9pins
Number of Terminals 254Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description FBGA-254
Number of Words 68719476736 wordsWord
Number of Words Code 64000000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x9
Gross weight 0.77 g
Operating temperature -40...163°C
Additional Feature DRAM IS ORGANISED AS 32G X 1
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Reach Compliance Code compliant
Current rating 1.5A
JESD-30 Code R-PBGA-B254
Organization 64GX8
Memory Width 8
Memory Density 549755813888 bit
Memory IC Type MEMORY CIRCUIT
Rated voltage 60V
Profile beryllium copper
Mixed Memory Type FLASH+DRAM
Plating thickness 0.75µm
Flammability rating UL94V-0
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KMDP6001DA-B425 Documents

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