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KS74HCTLS822N Tech Specifications

Samsung  KS74HCTLS822N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 24Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description DIP, DIP24,.3
Load Capacitance (CL) 50 pF
Moisture Sensitivity Levels 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
Pbfree Code No
Terminal Finish TIN LEAD
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 10Functions
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
JESD-30 Code R-PDIP-T24
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Output Characteristics 3-STATE
Logic IC Type D FLIP-FLOP
Max I(ol) 0.024 A
Trigger Type POSITIVE EDGE
Max Frequency@Nom-Sup 30000000 Hz
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KS74HCTLS822N Documents

Download datasheets and manufacturer documentation for   KS74HCTLS822N

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