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| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. Part #SIW3500DIF1Twicea Part #673-510-SIW3500DIF1 | RF Micro Devices Inc |
Description: Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 94 | RF MICRO DEVICES INC | - | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | DIE | Yes | 1.8 V | e2 | - | - | TIN SILVER | 8542.39.00.01 | BOTTOM | BALL | - | 1 | - | compliant | - | 94 | S-PBGA-B94 | Not Qualified | INDUSTRIAL | - | 0.415 mm | TELECOM CIRCUIT | 3.7 mm | 3.7 mm | ||
| SIW3500DIF1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF6569SBTwicea Part #673-510-RF6569SB | RF Micro Devices Inc |
Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 28 | RF MICRO DEVICES INC | - | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, | - | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Transferred | - | - | 3.6 V | - | - | 5A991.G | - | 8517.70.00.00 | BOTTOM | BUTT | - | 1 | - | unknown | - | - | S-XBGA-B28 | - | INDUSTRIAL | - | 1.25 mm | TELECOM CIRCUIT | 5.5 mm | 5 mm | ||
| RF6569SB | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #SIW3500GIG1Twicea Part #673-510-SIW3500GIG1 | RF Micro Devices Inc |
Description: Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 96 | RF MICRO DEVICES INC | - | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | - | - | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | - | 1 | 0.5 mm | compliant | - | 96 | S-PBGA-B96 | Not Qualified | INDUSTRIAL | - | 1 mm | TELECOM CIRCUIT | 6 mm | 6 mm | ||
| SIW3500GIG1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF3225Twicea Part #673-510-RF3225 | RF Micro Devices Inc |
Description: RF and Baseband Circuit
Datasheet
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| 25
In Stock
| Min.:1 Mult.:1 | YES | 17 | RF MICRO DEVICES INC | 5A | 85 °C | -30 °C | PLASTIC/EPOXY | HTSON | HTSON, | - | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Transferred | SOIC | Yes | 3.6 V | - | Yes | 5A991.G | - | 8542.33.00.01 | DUAL | NO LEAD | - | 1 | - | compliant | - | 17 | S-PDSO-N17 | Not Qualified | OTHER | - | 1.05 mm | RF AND BASEBAND CIRCUIT | 5 mm | 5 mm | |
| RF3225 | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFFM6403Twicea Part #673-510-RFFM6403 | RF Micro Devices Inc |
Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 28 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, LCC28,.24SQ,28 | LCC28,.24SQ,28 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Transferred | - | Yes | 3.6 V | - | - | - | - | 8542.39.00.01 | BOTTOM | BUTT | - | 1 | 0.7 mm | unknown | - | - | S-XBGA-B28 | Not Qualified | INDUSTRIAL | 1.5 mA | 1.05 mm | TELECOM CIRCUIT | 6 mm | 6 mm | ||
| RFFM6403 | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF2423Twicea Part #673-510-RF2423 | RF Micro Devices Inc |
RF and Baseband Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 16 | RF MICRO DEVICES INC | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.25 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | - | - | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 1.27 mm | unknown | - | 16 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | - | 1.905 mm | RF AND BASEBAND CIRCUIT | 9.9 mm | 3.9 mm | ||
| RF2423 | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF5225Twicea Part #673-510-RF5225 | RF Micro Devices Inc |
RF and Baseband Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 16 | RF MICRO DEVICES INC | - | 65 °C | -15 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.7 V | - | - | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 16 | S-XQCC-N16 | Not Qualified | COMMERCIAL | - | 0.55 mm | RF AND BASEBAND CIRCUIT | 3 mm | 3 mm | ||
| RF5225 | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFDA0057SQTwicea Part #673-510-RFDA0057SQ | RF Micro Devices Inc |
RF and Baseband Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 32 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | BCC | BCC, | - | SQUARE | CHIP CARRIER | Transferred | MCM | Yes | 5 V | - | Yes | 5A991.G | - | 8542.33.00.01 | BOTTOM | BUTT | - | 1 | 0.7 mm | compliant | - | 32 | S-XBCC-B32 | - | INDUSTRIAL | - | 1.25 mm | RF AND BASEBAND CIRCUIT | 7 mm | 7 mm | ||
| RFDA0057SQ | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFFC2072SQTwicea Part #673-510-RFFC2072SQ | RF Micro Devices Inc |
Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 32 | RF MICRO DEVICES INC | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3 V | - | Yes | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | - | 1 mm | TELECOM CIRCUIT | 5 mm | 5 mm | ||
| RFFC2072SQ | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF1201Twicea Part #673-510-RF1201 | RF Micro Devices Inc |
RF and Baseband Circuit
Datasheet
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| 19080
In Stock
| Min.:1 Mult.:1 | YES | 6 | RF MICRO DEVICES INC | - | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 2.65 V | - | - | 5A991.G | - | 8541.29.00.75 | QUAD | NO LEAD | - | 1 | 0.65 mm | unknown | - | 6 | S-XQCC-N6 | Not Qualified | OTHER | - | 0.9 mm | RF AND BASEBAND CIRCUIT | 2 mm | 2 mm | |
| RF1201 |
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