Zarlink LE75183BFQC Modems ICs and Modules QUAD
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LE75183BFQC Tech Specifications
Microsemi ZARLINK LE75183BFQC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 32Terminals | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | QFN | |
| Package Description | HVQCCN, | |
| Risk Rank | 5.55 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Supply Voltage-Nom | 5 V | |
| Rohs Code | Yes | |
| Manufacturer Part Number | LE75183BFQC | |
| JESD-609 Code | e3 | |
| Terminal Finish | MATTE TIN | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 32 | |
| JESD-30 Code | S-XQCC-N32 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 1 mm | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Length | 8 mm | |
| Width | 8 mm |
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