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| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Number of Bits | Seated Height-Max | Screening Level | Bus Compatibility | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. Part #XCZU3EG-2LSFVC784ITwicea Part #2937-489-XCZU3EG-2LSFVC784I | AMD |
Programmable SoC, CMOS, PBGA784, FCBGA-784
Datasheet
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| Min.:1 Mult.:1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.32 mm | - | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||
| XCZU3EG-2LSFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU19EG-3FFVD1760ITwicea Part #2937-489-XCZU19EG-3FFVD1760I | AMD |
Programmable SoC, CMOS, PBGA1760, FCBGA-1760
Datasheet
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| Min.:1 Mult.:1 | YES | 1760 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1760 | - | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.9 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B1760 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.71 mm | - | - | 42.5 mm | 42.5 mm | ||
| XCZU19EG-3FFVD1760I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6EG-2LFFVB1156ETwicea Part #2937-489-XCZU6EG-2LFFVB1156E | AMD |
Description: Programmable SoC, CMOS, PBGA1156, FCBGA-1156
Datasheet
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| Min.:1 Mult.:1 | YES | 1156 | ADVANCED MICRO DEVICES INC | 4 | - | 110 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1156 | - | OTHER | - | PROGRAMMABLE SoC | - | 3.42 mm | - | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU6EG-2LFFVB1156E | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-2LFFVC900ETwicea Part #2937-489-XCZU9CG-2LFFVC900E | AMD |
Programmable SoC, CMOS, PBGA900, FCBGA-900
Datasheet
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| Min.:1 Mult.:1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | - | 110 °C | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B900 | - | OTHER | - | PROGRAMMABLE SoC | - | 3.42 mm | - | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||
| XCZU9CG-2LFFVC900E | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6CG-2SBVA484ITwicea Part #2937-489-XCZU6CG-2SBVA484I | AMD |
Description: Programmable SoC, CMOS, PBGA484, BGA-484
Datasheet
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| Min.:1 Mult.:1 | YES | 484 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B484 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 2.61 mm | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU6CG-2SBVA484I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-1SFVC784ITwicea Part #2937-489-XCZU9CG-1SFVC784I | AMD |
Description: Programmable SoC, CMOS, PBGA784, BGA-784
Datasheet
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| Min.:1 Mult.:1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.32 mm | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||
| XCZU9CG-1SFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #AM8052-6JC/50Twicea Part #2937-489-AM8052-6JC/50 | AMD |
Display Controller, MOS, PQCC68
Datasheet
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| Min.:1 Mult.:1 | YES | 68 | ADVANCED MICRO DEVICES INC | - | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | e0 | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J68 | Not Qualified | COMMERCIAL | - | - | - | - | - | - | - | - | ||
| AM8052-6JC/50 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU2EG-2LSFVA625ETwicea Part #2937-489-XCZU2EG-2LSFVA625E | AMD |
Programmable SoC, CMOS, PBGA625, FCBGA-625
Datasheet
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| Min.:1 Mult.:1 | YES | 625 | ADVANCED MICRO DEVICES INC | 4 | - | 110 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B625 | - | OTHER | - | PROGRAMMABLE SoC | - | 3.43 mm | - | CAN, I2C, SPI, UART | 21 mm | 21 mm | ||
| XCZU2EG-2LSFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU4CG-1LSFVC784ITwicea Part #2937-489-XCZU4CG-1LSFVC784I | AMD |
Programmable SoC, CMOS, PBGA784, FCBGA-784
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.32 mm | - | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||
| XCZU4CG-1LSFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-1SFVC784ETwicea Part #2937-489-XCZU9CG-1SFVC784E | AMD |
Programmable SoC, CMOS, PBGA784, BGA-784
Datasheet
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| Min.:1 Mult.:1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | - | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | OTHER | - | PROGRAMMABLE SoC | - | 3.32 mm | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||
| XCZU9CG-1SFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6CG-1LFFVB1156ITwicea Part #2937-489-XCZU6CG-1LFFVB1156I | AMD |
Programmable SoC, CMOS, PBGA1156, FCBGA-1156
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1156 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1156 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.42 mm | - | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU6CG-1LFFVB1156I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU11EG-1LFFVC1760ITwicea Part #2937-489-XCZU11EG-1LFFVC1760I | AMD |
Description: Programmable SoC, CMOS, PBGA1760, FCBGA-1760
Datasheet
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| Min.:1 Mult.:1 | YES | 1760 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1760 | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1760 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.71 mm | - | CAN, I2C, SPI, UART | 42.5 mm | 42.5 mm | ||
| XCZU11EG-1LFFVC1760I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU3CG-1LSFVA625ITwicea Part #2937-489-XCZU3CG-1LSFVA625I | AMD |
Programmable SoC, CMOS, PBGA625, FCBGA-625
Datasheet
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| Min.:1 Mult.:1 | YES | 625 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B625 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.43 mm | - | CAN, I2C, SPI, UART | 21 mm | 21 mm | ||
| XCZU3CG-1LSFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #AM2951DMBTwicea Part #2937-489-AM2951DMB | AMD |
Parallel I/O Port, 8-Bit, 8 I/O, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28
Datasheet
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| 500
In Stock
| Min.:1 Mult.:1 | NO | 28 | ADVANCED MICRO DEVICES INC | - | 16 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 28 | R-CDIP-T28 | Not Qualified | MILITARY | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 8 | 5.715 mm | MIL-STD-883 Class B (Modified) | - | 37.338 mm | 15.24 mm | |
| AM2951DMB | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU19EG-2LFFVC1760ETwicea Part #2937-489-XCZU19EG-2LFFVC1760E | AMD |
Programmable SoC, CMOS, PBGA1760, FCBGA-1760
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1760 | ADVANCED MICRO DEVICES INC | 4 | - | 110 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1760 | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1760 | - | OTHER | - | PROGRAMMABLE SoC | - | 3.71 mm | - | CAN, I2C, SPI, UART | 42.5 mm | 42.5 mm | ||
| XCZU19EG-2LFFVC1760E | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU3CG-1LSFVC784ITwicea Part #2937-489-XCZU3CG-1LSFVC784I | AMD |
Programmable SoC, CMOS, PBGA784, FCBGA-784
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.32 mm | - | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||
| XCZU3CG-1LSFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6CG-2SFVA625ITwicea Part #2937-489-XCZU6CG-2SFVA625I | AMD |
Programmable SoC, CMOS, PBGA625, BGA-625
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 625 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B625 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.43 mm | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | ||
| XCZU6CG-2SFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-1LFFVC900ITwicea Part #2937-489-XCZU9CG-1LFFVC900I | AMD |
Description: Programmable SoC, CMOS, PBGA900, FCBGA-900
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B900 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.42 mm | - | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||
| XCZU9CG-1LFFVC900I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU11EG-3FFVB1517ITwicea Part #2937-489-XCZU11EG-3FFVB1517I | AMD |
Programmable SoC, CMOS, PBGA1517, FCBGA-1517
Datasheet
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| Min.:1 Mult.:1 | YES | 1517 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1517 | - | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.9 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B1517 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 3.51 mm | - | - | 40 mm | 40 mm | ||
| XCZU11EG-3FFVB1517I | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU5EV-3FBVB900ITwicea Part #2937-489-XCZU5EV-3FBVB900I | AMD |
Programmable SoC, CMOS, PBGA900, FCBGA-900
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | - | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.9 V | e1 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | INDUSTRIAL | - | PROGRAMMABLE SoC | - | 2.88 mm | - | - | 31 mm | 31 mm | ||
| XCZU5EV-3FBVB900I |
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