Embedded - Microcontrollers - Application Specific Products For Sale - PDF - Integrated Circuits (ICs) -Page4

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Integrated Circuits (ICs)
Embedded - Microcontrollers - Application Specific

Image	Part #	Manufacturer	Description	Quantity	Surface Mount	Number of Terminals	Ihs Manufacturer	Moisture Sensitivity Levels	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	JESD-609 Code	Terminal Finish	Additional Feature	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	JESD-30 Code	Temperature Grade	uPs/uCs/Peripheral ICs Type	Seated Height-Max	Bus Compatibility	Length	Width
	Mfr. Part # XCZU5CG-2LFBVB900I Twicea Part # 2937-489-XCZU5CG-2LFBVB900I	AMD	Programmable SoC, CMOS, PBGA900, FCBGA-900 Datasheet Compare	Min.:1 Mult.:1	YES	900	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	FCBGA-900	BGA900,30X30,40	SQUARE	GRID ARRAY	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU5CG-2LFBVB900I 2937-489-XCZU5CG-2LFBVB900I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU3EG-3SFVA625E Twicea Part # 2937-489-XCZU3EG-3SFVA625E	AMD	Programmable SoC, CMOS, PBGA625, FLIPCHIP-625 Datasheet Compare	Min.:1 Mult.:1	YES	625	ADVANCED MICRO DEVICES INC	4	100 °C	-	PLASTIC/EPOXY	BGA	FLIPCHIP-625	-	SQUARE	GRID ARRAY	Active	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	250	-	compliant	30	S-PBGA-B625	OTHER	PROGRAMMABLE SoC	-	-	-	-
XCZU3EG-3SFVA625E 2937-489-XCZU3EG-3SFVA625E AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU2CG-1LSBVA484I Twicea Part # 2937-489-XCZU2CG-1LSBVA484I	AMD	Programmable SoC, CMOS, PBGA484, FCBGA-484 Datasheet Compare	Min.:1 Mult.:1	YES	484	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FCBGA-484	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	-	0.8 mm	compliant	-	S-PBGA-B484	INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	CAN, I2C, SPI, UART	19 mm	19 mm
XCZU2CG-1LSBVA484I 2937-489-XCZU2CG-1LSBVA484I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU11EG-3FFVF1517I Twicea Part # 2937-489-XCZU11EG-3FFVF1517I	AMD	Programmable SoC, CMOS, PBGA1517, FCBGA-1517 Datasheet Compare	Min.:1 Mult.:1	YES	1517	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	FCBGA-1517	-	SQUARE	GRID ARRAY	Active	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1517	INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm	-	40 mm	40 mm
XCZU11EG-3FFVF1517I 2937-489-XCZU11EG-3FFVF1517I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU6CG-1FBVB900E Twicea Part # 2937-489-XCZU6CG-1FBVB900E	AMD	Programmable SoC, CMOS, PBGA900, BGA-900 Datasheet Compare	Min.:1 Mult.:1	YES	900	ADVANCED MICRO DEVICES INC	4	100 °C	-	PLASTIC/EPOXY	BGA	BGA-900	BGA900,30X30,40	SQUARE	GRID ARRAY	Active	Yes	0.876 V	0.825 V	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	OTHER	PROGRAMMABLE SoC	2.88 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	31 mm	31 mm
XCZU6CG-1FBVB900E 2937-489-XCZU6CG-1FBVB900E AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU19EG-1LFFVE1924I Twicea Part # 2937-489-XCZU19EG-1LFFVE1924I	AMD	Programmable SoC, CMOS, PBGA1924, FCBGA-1924 Datasheet Compare	Min.:1 Mult.:1	YES	1924	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	FCBGA-1924	BGA1924,44X44,40	SQUARE	GRID ARRAY	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	-	1 mm	compliant	-	S-PBGA-B1924	INDUSTRIAL	PROGRAMMABLE SoC	3.71 mm	CAN, I2C, SPI, UART	45 mm	45 mm
XCZU19EG-1LFFVE1924I 2937-489-XCZU19EG-1LFFVE1924I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU3EG-2LSFVA625E Twicea Part # 2937-489-XCZU3EG-2LSFVA625E	AMD	Description: Programmable SoC, CMOS, PBGA625, FCBGA-625 Datasheet Compare	Min.:1 Mult.:1	YES	625	ADVANCED MICRO DEVICES INC	4	110 °C	-	PLASTIC/EPOXY	FBGA	FCBGA-625	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	-	0.8 mm	compliant	-	S-PBGA-B625	OTHER	PROGRAMMABLE SoC	3.43 mm	CAN, I2C, SPI, UART	21 mm	21 mm
XCZU3EG-2LSFVA625E 2937-489-XCZU3EG-2LSFVA625E AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU5EV-2LSFVC784E Twicea Part # 2937-489-XCZU5EV-2LSFVC784E	AMD	Programmable SoC, CMOS, PBGA784, FCBGA-784 Datasheet Compare	Min.:1 Mult.:1	YES	784	ADVANCED MICRO DEVICES INC	4	110 °C	-	PLASTIC/EPOXY	FBGA	FCBGA-784	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	OTHER	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU5EV-2LSFVC784E 2937-489-XCZU5EV-2LSFVC784E AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU3EG-1LSBVA484I Twicea Part # 2937-489-XCZU3EG-1LSBVA484I	AMD	Programmable SoC, CMOS, PBGA484, FCBGA-484 Datasheet Compare	Min.:1 Mult.:1	YES	484	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FCBGA-484	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	-	0.8 mm	compliant	-	S-PBGA-B484	INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	CAN, I2C, SPI, UART	19 mm	19 mm
XCZU3EG-1LSBVA484I 2937-489-XCZU3EG-1LSBVA484I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU7EG-3FFVC1156I Twicea Part # 2937-489-XCZU7EG-3FFVC1156I	AMD	Programmable SoC, CMOS, PBGA1156, FCBGA-1156 Datasheet Compare	Min.:1 Mult.:1	YES	1156	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	FCBGA-1156	-	SQUARE	GRID ARRAY	Active	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm	-	35 mm	35 mm
XCZU7EG-3FFVC1156I 2937-489-XCZU7EG-3FFVC1156I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU6CG-1SBVA484I Twicea Part # 2937-489-XCZU6CG-1SBVA484I	AMD	Programmable SoC, CMOS, PBGA484, BGA-484 Datasheet Compare	Min.:1 Mult.:1	YES	484	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA-484	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Yes	0.876 V	0.825 V	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B484	INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	19 mm	19 mm
XCZU6CG-1SBVA484I 2937-489-XCZU6CG-1SBVA484I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU19EG-2LFFVD1760E Twicea Part # 2937-489-XCZU19EG-2LFFVD1760E	AMD	Programmable SoC, CMOS, PBGA1760, FCBGA-1760 Datasheet Compare	Min.:1 Mult.:1	YES	1760	ADVANCED MICRO DEVICES INC	4	110 °C	-	PLASTIC/EPOXY	BGA	FCBGA-1760	BGA1760,42X42,40	SQUARE	GRID ARRAY	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	-	1 mm	compliant	-	S-PBGA-B1760	OTHER	PROGRAMMABLE SoC	3.71 mm	CAN, I2C, SPI, UART	42.5 mm	42.5 mm
XCZU19EG-2LFFVD1760E 2937-489-XCZU19EG-2LFFVD1760E AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU9CG-2SFVA625I Twicea Part # 2937-489-XCZU9CG-2SFVA625I	AMD	Programmable SoC, CMOS, PBGA625, BGA-625 Datasheet Compare	Min.:1 Mult.:1	YES	625	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA-625	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Yes	0.876 V	0.825 V	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625	INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	21 mm	21 mm
XCZU9CG-2SFVA625I 2937-489-XCZU9CG-2SFVA625I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU19EG-3FFVC1760I Twicea Part # 2937-489-XCZU19EG-3FFVC1760I	AMD	Description: Programmable SoC, CMOS, PBGA1760, FCBGA-1760 Datasheet Compare	Min.:1 Mult.:1	YES	1760	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	FCBGA-1760	-	SQUARE	GRID ARRAY	Active	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1760	INDUSTRIAL	PROGRAMMABLE SoC	3.71 mm	-	42.5 mm	42.5 mm
XCZU19EG-3FFVC1760I 2937-489-XCZU19EG-3FFVC1760I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU9CG-L1FBVB900I Twicea Part # 2937-489-XCZU9CG-L1FBVB900I	AMD	Programmable SoC, CMOS, PBGA900, BGA-900 Datasheet Compare	Min.:1 Mult.:1	YES	900	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA-900	BGA900,30X30,40	SQUARE	GRID ARRAY	Active	Yes	0.742 V	0.698 V	0.72 V	e1	TIN SILVER COPPER	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	31 mm	31 mm
XCZU9CG-L1FBVB900I 2937-489-XCZU9CG-L1FBVB900I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU6CG-1SFVA625I Twicea Part # 2937-489-XCZU6CG-1SFVA625I	AMD	Description: Programmable SoC, CMOS, PBGA625, BGA-625 Datasheet Compare	Min.:1 Mult.:1	YES	625	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA-625	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Yes	0.876 V	0.825 V	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625	INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	21 mm	21 mm
XCZU6CG-1SFVA625I 2937-489-XCZU6CG-1SFVA625I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU5CG-2LSFVC784I Twicea Part # 2937-489-XCZU5CG-2LSFVC784I	AMD	Description: Programmable SoC, CMOS, PBGA784, FCBGA-784 Datasheet Compare	Min.:1 Mult.:1	YES	784	ADVANCED MICRO DEVICES INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FCBGA-784	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU5CG-2LSFVC784I 2937-489-XCZU5CG-2LSFVC784I AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU3CG-2LSFVC784E Twicea Part # 2937-489-XCZU3CG-2LSFVC784E	AMD	Programmable SoC, CMOS, PBGA784, FCBGA-784 Datasheet Compare	Min.:1 Mult.:1	YES	784	ADVANCED MICRO DEVICES INC	4	110 °C	-	PLASTIC/EPOXY	FBGA	FCBGA-784	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	OTHER	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU3CG-2LSFVC784E 2937-489-XCZU3CG-2LSFVC784E AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU7CG-2LFFVC1156E Twicea Part # 2937-489-XCZU7CG-2LFFVC1156E	AMD	Programmable SoC, CMOS, PBGA1156, FCBGA-1156 Datasheet Compare	Min.:1 Mult.:1	YES	1156	ADVANCED MICRO DEVICES INC	4	110 °C	-	PLASTIC/EPOXY	BGA	FCBGA-1156	BGA1156,34X34,40	SQUARE	GRID ARRAY	Active	Yes	-	-	0.85 V	e1	TIN SILVER COPPER	-	BOTTOM	BALL	-	1 mm	compliant	-	S-PBGA-B1156	OTHER	PROGRAMMABLE SoC	3.51 mm	CAN, I2C, SPI, UART	35 mm	35 mm
XCZU7CG-2LFFVC1156E 2937-489-XCZU7CG-2LFFVC1156E AMD RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCZU6CG-2LFFVB1156I Twicea Part # 2937-489-XCZU6CG-2LFFVB1156I	AMD	Programmable SoC, CMOS, PBGA1156, FCBGA-1156 Datasheet Compare	Min.:1 Mult.:1	YES	1156	ADVANCED MICRO DEVICES INC	-	100 °C	-40 °C	PLASTIC/EPOXY	BGA	FCBGA-1156	BGA1156,34X34,40	SQUARE	GRID ARRAY	Active	Yes	-	-	0.85 V	-	-	-	BOTTOM	BALL	-	1 mm	compliant	-	S-PBGA-B1156	INDUSTRIAL	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	35 mm	35 mm
XCZU6CG-2LFFVB1156I 2937-489-XCZU6CG-2LFFVB1156I AMD RoHS : Package : - In Stock : - 1 : -

Integrated Circuits (ICs)

Embedded - Microcontrollers - Application Specific definition: A Microcontroller can be considered a self-contained system with a processor, memory and peripherals and can be used as an embedded system. ... Embedded - Microcontrollers - Application Specific Product Listing: XCZU5CG-2LFBVB900I,XCZU3EG-3SFVA625E,XCZU2CG-1LSBVA484I,XCZU11EG-3FFVF1517I,XCZU6CG-1FBVB900E.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134273),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Embedded - Microcontrollers - Application Specific has 158 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Twicea.

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Integrated Circuits (ICs)